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標準編號 標準名稱 發布部門 發布日期 狀態
I.S. EN 60749-28:2017 Semiconductor Devices - Mechanical and Climatic Test Methods Part 28: Electrostatic Discharge (esd) Sensitivity Testing - Charged Device Model (cdm) - Device Level National S.. 2017-07-18 現行
I.S. EN 60749-3:2017 Semiconductor Devices - Mechanical and Climatic Test Methods Part 3: External Visual Examination National S.. 2017-07-04 現行
I.S. EN 60749-6:2017 Semiconductor Devices - Mechanical and Climatic Test Methods Part 6: Storage at High Temperature National S.. 2017-07-04 現行
I.S. EN 60749-9:2017 Semiconductor Devices - Mechanical and Climatic Test Methods Part 9: Permanence of Marking National S.. 2017-07-04 現行
I.S. EN 60749-4:2017 Semiconductor Devices - Mechanical and Climatic Test Methods Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (hast) National S.. 2017-07-04 現行
KS C IEC 60749-34:2017 Semiconductor devices - Mechanical and climatic test methods - Part 34:Power cycling Korean Sta.. 2017-05-30 廢止
IEC 60749-5 Ed. 2.0 Semiconductor devices - Mechanical and climatic test methods Part 5: Steady-state temperature humidity bias life test Internatio.. 2017-04-10 現行
DIN EN 60749-41 (2017-04) Semiconductor devices - Mechanical and climatic test methods Part 41: Reliability testing methods of non-volatile memory devices (IEC 47/2325/CD:2016) German Ins.. 2017-04-01 現行
DIN EN 60749-44 (2017-04) Semiconductor Devices - Mechanical And Climatic Test Methods - Part 44: Neutron Beam Irradiated Single Event Effect (see) Test Method For Semiconductor Devices (iec 60749-44:2016) German Ins.. 2017-04-01 現行
IEC 60749-28 Ed. 1.0 Semiconductor devices - Mechanical and climatic test methods Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level Internatio.. 2017-03-28 現行
IEC 60749-9 Ed. 2.0 Semiconductor devices - Mechanical and climatic test methods Part 9: Permanence of marking Internatio.. 2017-03-03 現行
IEC 60749-3 Ed. 2.0 Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination Internatio.. 2017-03-03 現行
IEC 60749-4 Ed. 2.0 Semiconductor devices - Mechanical and climatic test methods Part 4: Damp heat, steady state, highly accelerated stress test (HAST) Internatio.. 2017-03-03 現行
IEC 60749-6 Ed. 2.0 Semiconductor devices - Mechanical and climatic test methods Part 6: Storage at high temperature Internatio.. 2017-03-03 現行
DIN EN 62779-3 (2017-03) Semiconductor Devices - Semiconductor Interface For Human Body Communication - Part 3: Functional Type And Its Operational Conditions (iec 62779-3:2016) Verband De.. 2017-03-01 現行
DIN EN 62779-1 (2017-01) Semiconductor Devices - Semiconductor Interface For Human Body Communication - Part 1: General Requirements (iec 62779-1:2016) Verband De.. 2017-01-01 現行
DIN EN 62779-2 (2017-01) Semiconductor Devices - Semiconductor Interface For Human Body Communication - Part 2: Characterization Of Interfacing Performances (iec 62779-2:2016) Verband De.. 2017-01-01 現行
KS C IEC 60749-42:2016 Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage Korean Sta.. 2016-12-29 廢止
I.S. EN 60191-6-13:2016 Mechanical Standardization of Semiconductor Devices Part 6-13: Design Guideline of Open-top-type Sockets for Fine-pitch Ball Grid Array (fbga) and Fine-pitch Land Grid Array (flga) National S.. 2016-12-13 現行
DIN EN 62047-1 (2016-12) Semiconductor Devices - Micro-electromechanical Devices - Part 1: Terms And Definitions (iec 62047-1:2016) German Ins.. 2016-12-01 現行
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