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已選條件： 其他半導體器件
每頁顯示20 條，共找到 558 條結果 <2/28>
標準編號 標準名稱 發布部門 發布日期 狀態
JIS C 6790:2016 Load Test Of A Bolt-clamped Langevin Vibrator Using Wattmeter Method Japanese S.. 2016-03-22 現行
IEC 60747-5-7 Ed. 1.0 Semiconductor devices Part 5-7: Optoelectronic devices - Photodiodes and phototransistors Internatio.. 2016-02-23 現行
IEC 60747-5-6 Ed. 1.0 Semiconductor devices Part 5-6: Optoelectronic devices - Light emitting diodes Internatio.. 2016-02-23 現行
IEC 62047-26 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices Part 26: Description and measurement methods for micro trench and needle structures Internatio.. 2016-01-07 現行
IEC 62047-1 Ed. 2.0 Semiconductor devices - Micro-electromechanical devices Part 1: Terms and definitions Internatio.. 2016-01-06 現行
KS C IEC 62047-8:2015 Semiconductor devices ? Micro-electromechanical devices ? Part 8: Strip bending test method for tensile property measurement of thin films Korean Sta.. 2015-12-30 現行
KS C IEC 62047-5:2015 Semiconductor devices - MEMS devices - Part 5: RF MEMS switches Korean Sta.. 2015-12-30 現行
KS C IEC 62047-7:2015 SEMICONDUCTOR DEVICES ? MICRO-ELECTROMECHANICAL DEVICES ? Part 7: MEMS BAW filter and duplexer for radio frequency control and selection Korean Sta.. 2015-12-30 現行
JIS C 5630-20:2015 Semiconductor Devices - Micro-electromechanical Devices - Part 20: Gyroscopes Japanese S.. 2015-11-20 現行
JIS C 8153:2015 Dc Or Ac Supplied Electronic Control Gear For Led Modules - Performance Requirements Japanese S.. 2015-10-20 現行
JIS C 8154:2015 Led Modules For General Lighting - Safety Specifications Japanese S.. 2015-10-20 現行
I.S. EN 62047-15:2015 Semiconductor Devices - Micro-electromechanical Devices Part 15: Test Method of Bonding Strength Between Pdms and Glass National S.. 2015-07-28 現行
I.S. EN 62047-17:2015 Semiconductor Devices - Micro-electromechanical Devices Part 17: Bulge Test Method for Measuring Mechanical Properties of Thin Films National S.. 2015-07-28 現行
I.S. EN 62047-16:2015 Semiconductor Devices - Micro-electromechanical Devices Part 16: Test Methods for Determining Residual Stresses of Mems Films - Wafer Curvature and Cantilever Beam Deflection Methods National S.. 2015-07-28 現行
OVE/ONORM EN 62477-1:2013 Safety Requirements For Power Electronic Converter Systems And Equipment - Part 1: General (Iec 62477-1:2012) Osterreich.. 2015-06-01 被替代
OVE/ONORM EN 62047-21:2015 Semiconductor Devices - Micro-Electromechanical Devices - Part 21: Test Method For Poisson's Ratio Of Thin Film Mems Materials (Iec 62047-21:2014) Osterreich.. 2015-06-01 現行
OVE/ONORM EN 62047-20:2015 Semiconductor Devices - Micro-Electromechanical Devices - Part 20: Gyroscopes (Iec 62047-20:2014) Osterreich.. 2015-06-01 現行
VDE 0558-477-1:2013 Safety Requirements For Power Electronic Converter Systems And Equipment - Part 1: General (Iec 62477-1:2012) Verband De.. 2015-05-01 被替代
IEC 62047-17 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices Part 17: Bulge test method for measuring mechanical properties of thin films Internatio.. 2015-03-05 現行
IEC 62047-15 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass Internatio.. 2015-03-05 現行
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