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標準編號 標準名稱 發布部門 發布日期 狀態
IEC 62031 Ed. 2.0 LED modules for general lighting - Safety specifications Internatio.. 2018-03-08 現行
I.S. EN IEC 62969-1:2018 Semiconductor Devices - Semiconductor Interface for Automotive Vehicles Part 1: General Requirements of Power Interface for Automotive Vehicle Sensors National S.. 2018-03-06 現行
IEC 62047-29 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature Internatio.. 2017-11-22 現行
IEC 60747-16-4 Amd.2 Ed. 1.0 Amendment 2 - Semiconductor devices Part 16-4: Microwave integrated circuits - Switches Internatio.. 2017-08-16 現行
IEC 60747-16-3 Amd.2 Ed. 1.0 Amendment 2 - Semiconductor devices Part 16-3: Microwave integrated circuits - Frequency converters Internatio.. 2017-08-16 現行
IEC 60747-16-4 Ed. 1.2 Semiconductor devices Part 16-4: Microwave integrated circuits - Switches Internatio.. 2017-08-16 現行
IEC 60747-16-3 Ed. 1.2 Semiconductor devices Part 16-3: Microwave integrated circuits - Frequency converters Internatio.. 2017-08-16 現行
DIN EN 60747-16-6 (2017-08) Semiconductor Devices - Part 16-6: Microwave Integrated Circuits - Frequency Multipliers (iec 47e/568/cd:2017) German Ins.. 2017-08-01 現行
IEC 62951-1 Ed. 1.0 Semiconductor devices - Flexible and stretchable semiconductor devices Part 1: Bending test method for conductive thin films on flexible substrates Internatio.. 2017-04-10 現行
JIS C 5630-1:2017 Semiconductor Devices - Micro-electromechanical Devices - Part 1: Terms And Definitions Japanese S.. 2017-03-21 現行
IEC 60747-16-1 Ed. 1.2 Semiconductor devices Part 16-1: Microwave integrated circuits - Amplifiers Internatio.. 2017-02-15 現行
IEC 60747-16-1 Amd.2 Ed. 1.0 Amendment 2 - Semiconductor devices Part 16-1: Microwave integrated circuits - Amplifiers Internatio.. 2017-02-15 現行
IEC 62047-27 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) Internatio.. 2017-01-20 現行
IEC 62047-28 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices Internatio.. 2017-01-20 現行
KS C IEC 62047-18:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials Korean Sta.. 2016-12-29 廢止
KS C IEC 62047-22:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials Korean Sta.. 2016-12-29 廢止
I.S. EN 62047-25:2016 Semiconductor Devices - Micro-electromechanical Devices Part 25: Silicon Based Mems Fabrication Technology - Measurement Method of Pull-press and Shearing Strength of Micro Bonding Area National S.. 2016-12-06 現行
IEC 62047-25 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area Internatio.. 2016-08-29 現行
I.S. EN 62047-26:2016 Semiconductor Devices - Micro-electromechanical Devices Part 26: Description and Measurement Methods for Micro Trench and Needle Structures National S.. 2016-05-10 現行
I.S. EN 62047-1:2016 Semiconductor Devices - Micro-electromechanical Devices Part 1: Terms and Definitions National S.. 2016-04-26 現行
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