IEC 60749-14 Ed. 1.0現行
Semiconductor devices - Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity)
出版：International Electrotechnical Committee
專家解讀視頻
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
NEN EN IEC 60749-14:2003 - Identical
EN 60749-14:2003 - Identical
UNE EN 60749-14:2004 - Identical
SS EN 60749-14 Ed. 1 (2004) - Identical
PN EN 60749-14:2005 - Identical
I.S. EN 60749-14:2003 - Identical
NF EN 60749-14:2004 - Identical
DIN EN 60749-14 (2004-07) - Identical
BS EN 60749-14:2003 - Identical
CEI EN 60749-14 Ed. 1 (2004) - Identical
