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DIN EN 60749-14 (2004-07)現(xiàn)行

Semiconductor Devices - Mechanical And Climatic Test Methods - Part 14: Robustness Of Terminations (lead Integrity)

出版：German Institute for Standardisation (Deutsches Institut für Normung)

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基本信息
標(biāo)準(zhǔn)編號(hào)： DIN EN 60749-14 (2004-07)
發(fā)布時(shí)間：2004/7/1 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：German Institute for Standardisation (Deutsches Institut für Normung)
標(biāo)準(zhǔn)頁(yè)數(shù)：0
標(biāo)準(zhǔn)簡(jiǎn)介

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

標(biāo)準(zhǔn)備注

Supersedes DIN EN 60749. (06/2005)

本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)

DIN EN 60749 (2002-09)

等同采用的國(guó)際標(biāo)準(zhǔn)

EN 60749-14:2003 - Identical

UNE EN 60749-14:2004 - Identical

BS EN 60749-14:2003 - Identical

NBN EN 60749-14:2004 - Identical

NF EN 60749-14:2004 - Identical

I.S. EN 60749-14:2003 - Identical

IEC 60749-14 Ed. 1.0 - Identical

SS EN 60749-14 Ed. 1 (2004) - Identical