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BS EN 60749-14:2003現(xiàn)行

Semiconductor devices. Mechanical and climatic test methods. Robustness of terminations (lead integrity)

出版：British Standards Institution

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基本信息

標(biāo)準(zhǔn)編號： BS EN 60749-14:2003

發(fā)布時間：2003/12/15 0:00:00

標(biāo)準(zhǔn)類別：Standard

出版單位：British Standards Institution

標(biāo)準(zhǔn)頁數(shù)：18

標(biāo)準(zhǔn)簡介

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

標(biāo)準(zhǔn)備注

? British Standards Institution 2013

Replaces notes:
Partially replaces BS EN 60749:1999.

本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)

02/204667 DC : DRAFT APR 2002

BS EN 60749 : 1999

BS EN 60749:1999

等同采用的國際標(biāo)準(zhǔn)

UNE EN 60749-14 : 2004 - Identical

NF EN 60749-14 : 2004 - Identical

IEC 60749-14 : 1.0 - Identical

NBN EN 60749-14 : 2004 - Identical

I.S. EN 60749-14:2003 - Identical