IEC 60068-2-58 Ed. 3.0被替代
Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
出版：International Electrotechnical Committee
專家解讀視頻
Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.
PN EN 60068-2-58:2007 - Identical
I.S. EN 60068-2-58:2004 - Identical
NBN EN 60068 2-58:2006 - Identical
NF EN 60068-2-58:2005 - Identical
OVE/ONORM EN 60068-2-58:2005 - Identical
DIN EN 60068-2-58 (2005-03) - Identical
BS EN 60068-2-58:2004 - Identical
CEI EN 60068-2-58 Ed. 2 (2005) - Identical
UNE 20501-2-58:1994 - Identical
SN EN 60068-2-58:1999 - Identical
NFC 20 758:1990 - Identical
HD 323.2.58:1992 - Identical
UNE EN 60068-2-58:2006 - Identical
SS EN 60068-2-58 Ed. 2 (2004) - Identical
AS 60068.2.58-2004 - Identical
SS EN 60068 Ed. 3 (2000) - Identical
NEN EN IEC 60068-2-58:2004 - Identical
