NFC 20 758:1990被替代
Environmental Testing - Test Td: Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版：Association Francaise de Normalisation
專家解讀視頻
基本信息
標準編號： NFC 20 758:1990
發布時間：1990/2/1 0:00:00
標準類別：Standard
出版單位：Association Francaise de Normalisation
標準頁數：14
標準簡介
The object of this test is to provide a standard procedure for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD) (hereinafter referred to as specimens). The procedure uses a solder bath and is applicable only to specimens of products designed to withstand short-term immersion in molten solder.
替代本標準的新標準
等同采用的國際標準
IEC 60068-2-58 Ed. 3.0 - Identical
