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NEN EN IEC 60068-2-58:2004被替代
Environmental Testing - Part 2-58: Tests - Test Td - Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版：Nederlands Normalisatie Instituut
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基本信息
標(biāo)準(zhǔn)編號(hào)： NEN EN IEC 60068-2-58:2004
發(fā)布時(shí)間：2004/10/1 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：Nederlands Normalisatie Instituut
標(biāo)準(zhǔn)頁數(shù)：24
標(biāo)準(zhǔn)簡(jiǎn)介
Provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. It also specifies standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
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IEC 60068-2-58 Ed. 3.0 - Identical
