DIN EN 61190-1-2 (2007-11)被替代
Attachment Materials For Electronic Assembly - Part 1-2: Requirements For Soldering Pastes For High-quality Interconnects In Electronics Assembly
出版：German Institute for Standardisation (Deutsches Institut für Normung)
專家解讀視頻
Describes general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
Supersedes DIN IEC 91-142-CD. (01/2003) Supersedes DIN IEC 61190-1-2. (11/2007) DRAFT AMD 1 issued in March 2012. (04/2012)
NF EN 61190-1-2:2002 - Identical
BS EN 61190-1-2:2007 - Identical
SS EN 61190-1-2 Ed. 3 (2014) - Identical
EN 61190-1-2:2014 - Identical
NF EN 61190-1-2:2014 - Identical
I.S. EN 61190-1-2:2007 - Identical
IEC 61190-1-2 Ed. 2.0 - Identical
SS EN 61190-1-2 Ed. 1 (2003) - Identical
SS EN 61190-1-2 Ed. 2 (2007) - Identical
NF EN 61190-1-2:2008 - Identical
