IEC 61190-1-2 Ed. 2.0被替代
Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
出版：International Electrotechnical Committee
專家解讀視頻
Specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. Serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
BS EN 61190-1-2:2007 - Identical
DIN EN 61190-1-2 (2007-11) - Identical
CEI EN 61190-1-2 Ed. 2 (2008) - Identical
SS EN 61190-1-2 Ed. 1 (2003) - Identical
NF EN 61190-1-2:2008 - Identical
NF EN 61190-1-2:2002 - Identical
CEI EN 61190-1-2 Ed. 1 (2003) - Identical
SS EN 61190-1-2 Ed. 2 (2007) - Identical
I.S. EN 61190-1-2:2007 - Identical
PN EN 61190-1-2:2006 - Identical
NEN EN IEC 61190-1-2:2007 - Identical
OVE/ONORM EN 61190-1-2:2007 - Identical
PN EN 61190-1-2:2008 - Identical
