NEN EN IEC 61190-1-2:2007被替代
Attachment Materials For Electronic Assembly - Part 1-2: Requirements For Soldering Pastes For High-quality Interconnects In Electronics Assembly
出版：Nederlands Normalisatie Instituut
專家解讀視頻
基本信息
標準編號： NEN EN IEC 61190-1-2:2007
發布時間：2007/8/1 0:00:00
標準類別：Standard
出版單位：Nederlands Normalisatie Instituut
標準頁數：18
標準簡介
Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. It serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
替代本標準的新標準
