IEC 61190-1-2 Ed. 1.0被替代
Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
出版：International Electrotechnical Committee
專家解讀視頻
基本信息
標準編號： IEC 61190-1-2 Ed. 1.0
發布時間：2002/3/22 0:00:00
標準類別：Standard
出版單位：International Electrotechnical Committee
標準頁數：35
標準簡介
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
替代本標準的新標準
等同采用的國際標準
BS EN 61190-1-2:2002 - Identical
