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每頁顯示20 條，共找到 558 條結(jié)果 <18/28>
標(biāo)準(zhǔn)編號 標(biāo)準(zhǔn)名稱 發(fā)布部門 發(fā)布日期 狀態(tài)
SS EN 62031:2008 Led Modules For General Lighting - Safety Specifications Standardis.. 2015-02-18 現(xiàn)行
BS EN 62031:2008+A2:2015 Led Modules For General Lighting - Safety Specifications British St.. 2015-01-31 現(xiàn)行
GOST IEC 62384:2013 Dc Or Ac Supplied Electronic Control Gear For Led Modules - Performance Requirements Interstand.. 2015-01-01 現(xiàn)行
JIS C 5630-18:2014 Semiconductor Devices - Micro-electromechanical Devices - Part 18: Bend Testing Methods Of Thin Film Materials Japanese S.. 2014-12-22 現(xiàn)行
JIS C 5630-19:2014 Semiconductor Devices - Micro-electromechanical Devices - Part 19: Electronic Compasses Japanese S.. 2014-12-22 現(xiàn)行
SS EN 62047-21 Ed. 1 (2014) Semiconductor Devices - Micro-Electromechanical Devices - Part 21: Test Method For Poisson's Ratio Of Thin Film Mems Materials Standardis.. 2014-12-18 現(xiàn)行
SS EN 62047-22 Ed. 1 (2014) Semiconductor Devices - Micro-Electromechanical Devices - Part 22: Electromechanical Tensile Test Method For Conductive Thin Films On Flexible Substrates Standardis.. 2014-12-18 現(xiàn)行
SS EN 62047-20 Ed. 1 (2014) Semiconductor Devices - Micro-Electromechanical Devices - Part 20: Gyroscopes Standardis.. 2014-12-18 現(xiàn)行
NF EN 62047-20:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 20: Gyroscopes Associatio.. 2014-12-01 現(xiàn)行
NF EN 62047-22:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 22: Electromechanical Tensile Test Method For Conductive Thin Films On Flexible Substrates Associatio.. 2014-12-01 現(xiàn)行
NF EN 62047-21:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 21: Test Method For Poisson's Ratio Of Thin Film Mems Materials Associatio.. 2014-12-01 現(xiàn)行
PD CLC/TR 62258-4:2013 Semiconductor Die Products - Part 4: Questionnaire For Die Users And Suppliers British St.. 2014-11-30 現(xiàn)行
DS EN 62047-21:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 21: Test Method For Poisson's Ratio Of Thin Film Mems Materials Danish Sta.. 2014-11-20 現(xiàn)行
DS EN 62047-20:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 20: Gyroscopes Danish Sta.. 2014-11-20 現(xiàn)行
NBN EN 62047-21:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 21: Test Method For Poisson's Ratio Of Thin Film Mems Materials Belgian St.. 2014-11-01 現(xiàn)行
NBN EN 62047-22:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 22: Electromechanical Tensile Test Method For Conductive Thin Films On Flexible Substrates Belgian St.. 2014-11-01 現(xiàn)行
NBN EN 62047-20:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 20: Gyroscopes Belgian St.. 2014-11-01 現(xiàn)行
BS EN 62047-21:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 21: Test Method For Poisson's Ratio Of Thin Film Mems Materials British St.. 2014-10-31 現(xiàn)行
BS EN 62047-20:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 20: Gyroscopes British St.. 2014-10-31 現(xiàn)行
I.S. EN 62047-21:2014 Semiconductor Devices - Microelectromechanical Devices Part 21: Test Method for Poisson's Ratio of Thin Film Mems Materials National S.. 2014-10-27 現(xiàn)行
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