IEC 60191-6-12 Ed. 1.0被替代
Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
出版：International Electrotechnical Committee
專家解讀視頻
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
BS EN 60191-6-12:2002 - Identical
DIN EN 60191-6-12 (2003-01) - Identical
NF EN 60191-6-12:2002 - Identical
I.S. EN 60191-6-12:2002 - Identical
PN EN 60191-6-12:2003 - Identical
SS EN 60191-6-12 Ed. 1 (2003) - Identical
UNE EN 60191-6-12:2004 - Identical
NEN EN IEC 60191-6-12:2002 - Identical
OVE/ONORM EN 60191-6-12:2003 - Identical
