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NEN EN IEC 60191-6-12:2002被替代
Mechanical Standardization Of Semiconductor Devices - Part 6-12: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Fine-pitch Land Grid Array (flga) - Rectangular Typeterminal Packages
出版：Nederlands Normalisatie Instituut
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基本信息
標(biāo)準(zhǔn)編號(hào)： NEN EN IEC 60191-6-12:2002
發(fā)布時(shí)間：2002/9/1 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：Nederlands Normalisatie Instituut
標(biāo)準(zhǔn)頁(yè)數(shù)：20
標(biāo)準(zhǔn)簡(jiǎn)介
Defines common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
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IEC 60191-6-12 Ed. 1.0 - Identical
