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DIN EN 60191-6-12 (2003-01)被替代

Mechanical Standardization Of Semiconductor Devices - Part 6-12: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Fine-pitch Land Grid Array (flga) - Rectangular Type

出版：German Institute for Standardisation (Deutsches Institut für Normung)

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基本信息
標(biāo)準(zhǔn)編號(hào)： DIN EN 60191-6-12 (2003-01)
發(fā)布時(shí)間：2003/1/1 0:00:00
標(biāo)準(zhǔn)類(lèi)別：Standard
出版單位：German Institute for Standardisation (Deutsches Institut für Normung)
標(biāo)準(zhǔn)頁(yè)數(shù)：0
標(biāo)準(zhǔn)簡(jiǎn)介

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

替代本標(biāo)準(zhǔn)的新標(biāo)準(zhǔn)

DIN EN 60191-6-12 (2011-12)

等同采用的國(guó)際標(biāo)準(zhǔn)

BS EN 60191-6-12:2002 - Identical

NF EN 60191-6-12:2002 - Identical

I.S. EN 60191-6-12:2002 - Identical

IEC 60191-6-12 Ed. 1.0 - Identical

SS EN 60191-6-12 Ed. 1 (2003) - Identical

UNE EN 60191-6-12:2004 - Identical