
Mechanical Standardization Of Semiconductor Devices - Part 6-12: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Fine-pitch Grid Array (flga) - Rectangular Type
出版:Association Francaise de Normalisation

專家解讀視頻
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
Indice de classement: C96-013-6-12. (12/2002)
SS EN 60191-6-12 Ed. 1 (2003) - Identical
UNE EN 60191-6-12:2004 - Identical
BS EN 60191-6-12:2002 - Identical
DIN EN 60191-6-12 (2003-01) - Identical
I.S. EN 60191-6-12:2002 - Identical
IEC 60191-6-12 Ed. 1.0 - Identical