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IEC 60749-14 : 1.0現(xiàn)行

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)

出版：International Electrotechnical Committee

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基本信息

標(biāo)準(zhǔn)編號(hào)： IEC 60749-14 : 1.0

發(fā)布時(shí)間：2003/8/7 0:00:00

標(biāo)準(zhǔn)類別：Standard

出版單位：International Electrotechnical Committee

標(biāo)準(zhǔn)頁數(shù)：36

標(biāo)準(zhǔn)簡介

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)

IEC PAS 62184 : 1.0

等同采用的國際標(biāo)準(zhǔn)

I.S. EN 60749-14:2003 - Identical

NF EN 60749-14 : 2004 - Identical

DS EN 60749-14 : 2003 - Identical

CEI EN 60749-14 : 2004 - Identical

BS EN 60749-14 : 2003 - Identical

DIN EN 60749-14 : 2004 - Identical

NEN EN IEC 60749-14 : 2003 - Identical

I.S. EN 60749-14:2003 - Identical

PN EN 60749-14 : 2005 - Identical