NEN EN IEC 60749-15:2003被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 15: Resistance To Soldering Temperature For Through-hole Mounted Devices
出版：Nederlands Normalisatie Instituut
專家解讀視頻
基本信息
標準編號： NEN EN IEC 60749-15:2003
發布時間：2003/6/1 0:00:00
標準類別：Standard
出版單位：Nederlands Normalisatie Instituut
標準頁數：11
標準簡介
Defines a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
替代本標準的新標準
等同采用的國際標準
IEC 60749-15 Ed. 1.0 - Identical
