NEN EN IEC 60749-15:2011現行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 15: Resistance To Soldering Temperature For Through-Hole Mounted Devices
出版：Nederlands Normalisatie Instituut
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基本信息
標準編號： NEN EN IEC 60749-15:2011
發布時間：2011/2/1 0:00:00
標準類別：Standard
出版單位：Nederlands Normalisatie Instituut
標準頁數：11
標準簡介
Explains a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
本標準替代的舊標準
等同采用的國際標準
EN 60749-15:2010 - Identical
