IEC 60749-15 Ed. 1.0被替代
Semiconductor devices - Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices
出版：International Electrotechnical Committee
專家解讀視頻
基本信息
標準編號： IEC 60749-15 Ed. 1.0
發布時間：2003/2/7 0:00:00
標準類別：Standard
出版單位：International Electrotechnical Committee
標準頁數：11
標準簡介
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
替代本標準的新標準
