NF EN 60749-20:2010現行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 20: Resistance Of Plastic Encapsulated Smds To The Combined Effect Of Moisture And Soldering Heat
出版：Association Francaise de Normalisation
專家解讀視頻
Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).
Indice de classement: C96-022-20. (12/2003) Supersedes NF EN 60749. (06/2007) PR NF EN 60749-20 September 2007. (09/2007) 2003 version is still active. (05/2010)
NBN EN 60749-20:2010 - Identical
I.S. EN 60749-20:2009 - Identical
EN 60749-20:2009 - Identical
BS EN 60749-20:2009 - Identical
UNE EN 60749-20:2004 - Identical
DIN EN 60749-20 (2010-04) - Identical
SS EN 60749-20 Ed. 2 (2010) - Identical
