
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 20: Resistance Of Plastic-encapsulated Smds To The Combined Effect Of Moisture And Soldering Heat
出版:Nederlands Normalisatie Instituut

專家解讀視頻
Defines a test method for assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs). Applies to semiconductor devices (discrete devices and integrated circuits).
IEC 60749-20 Ed. 1.0 - Identical