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每頁顯示20 條，共找到 122 條結果 <2/7>
標準編號 標準名稱 發布部門 發布日期 狀態
DIN EN 61837-2 (2012-04) Surface Mounted Piezoelectric Devices For Frequency Control And Selection - Standard Outlines And Terminal Lead Connections - Part 2: Ceramic Enclosures (iec 61837-2:2011) German Ins.. 2012-04-01 被替代
12/30240059 DC BS EN IEC 62715-1-1. Flexible display devices. Terminology and letter symbols British St.. 2012-02-27 被替代
GOST 2.702:2011 Unified System For Design Documentation - Rules For Presentation Of Electric Schemes Interstand.. 2012-01-01 現行
DIN EN 60191-6-12 (2011-12) Mechanical Standardization Of Semiconductor Devices - Part 6-12: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guidelines For Fine-pitch Land Grid Array (flga) (iec 60191-6-12:2011) German Ins.. 2011-12-01 現行
DIN EN 60191-6-17 (2011-09) Mechanical Standardization Of Semiconductor Devices - Part 6-17: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Stacked Packages - Fine-pitch Ball Grid Array And Fine-pitch Land Grid Array (p-pfbga And P-pflga) German Ins.. 2011-09-01 現行
DIN EN 60191-6-22 (2011-08) Mechanical Standardization Of Semiconductor Devices - Part 6-22: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Semiconductor Packages Silicon Fine-pitch Ball Grid Array And Silicon Fine-pitch Land Grid Array (s-fbga And S-flga) (iec 47d/802/cd:2011) German Ins.. 2011-08-01 被替代
BS EN 60191-6-17:2011 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) British St.. 2011-06-30 現行
DIN EN 60191-6-20 (2011-03) Mechanical Standardization Of Semiconductor Devices - Part 6-20: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Measuring Methods For Package Dimensions Of Small Outline J-lead Packages (soj) German Ins.. 2011-03-01 現行
DIN EN 60191-6-21 (2011-03) Mechanical Standardization Of Semiconductor Devices - Part 6-21: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Measuring Methods For Package Dimensions Of Small Outline Packages (sop) German Ins.. 2011-03-01 現行
11/30242512 DC BS EN 60848. GRAFCET specification language for sequential function charts British St.. 2011-01-28 被替代
DS HDBK 166-1:2010 Industrial Systems, Installations And Equipment And Industrial Products - Structuring Principles And Reference Designations Danish Sta.. 2010-09-08 現行
DS HDBK 166:2010 A Guide To Reference Designations - Preparation Of Tag Numbers, Letter Codes, Modularization And Interfaces Between Systems Danish Sta.. 2010-09-02 被替代
PN EN 60191-6:2010 Mechanical Standardization Of Semiconductor Devices - Part 6: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages Polish Com.. 2010-08-25 現行
DIN EN 60191-6-18 (2010-08) Mechanical Standardization Of Semiconductor Devices - Part 6-18: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Ball Grid Array (bga) German Ins.. 2010-08-01 現行
DIN IEC 60191-6-1 (2010-07) Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010) German Ins.. 2010-07-01 廢止
DIN EN 60191-6 (2010-06) Mechanical Standardization Of Semiconductor Devices - Part 6: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages German Ins.. 2010-06-01 現行
10/30227781 DC BS EN 60191-6-1. Mechanical standardization of semiconductor devices. Part 6-1. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals British St.. 2010-05-06 現行
DIN IEC 60191-6-12 (2010-04) Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010) German Ins.. 2010-04-01 被替代
DIN IEC 61240 (2010-03) Piezoelectric devices - Preparation of outline drawings of surface mounted devices (SMD) for frequency control and selection - General rules (IEC 49/894/CD:2009) German Ins.. 2010-03-01 被替代
10/30215537 DC BS EN 60191-6-12. Mechanical standardization of semiconductor devices. Part 6-12. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch land grid array (FLGA). Rectangular type British St.. 2010-01-12 被替代
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