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標(biāo)準(zhǔn)編號(hào) |
標(biāo)準(zhǔn)名稱 |
發(fā)布部門 |
發(fā)布日期 |
狀態(tài) |
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JIS TS C62610-2:2015 |
Mechanical Structures For Electronic Equipment - Thermal Management For Cabinets With Iec 60297 (all Parts) And Jis C 6010 (all Parts) - Design Guide: Method For The Determination Of Forced Air-cooling Structure |
Japanese S.. |
2015-11-20 |
現(xiàn)行 |
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JIS C 6011-2:2015 |
Mechanical Structures For Electronic Equipment - Tests For Iec 60917 And Iec 60297 - Part 2: Seismic Tests For Cabinets And Racks |
Japanese S.. |
2015-11-20 |
現(xiàn)行 |
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ASTM F375-89(2015) |
Standard Specification for Integrated Circuit Lead Frame Material |
American S.. |
2015-07-01 |
現(xiàn)行 |
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BS EN 60286-2:2015 |
Packaging Of Components For Automatic Handling - Part 2: Packaging Of Components With Unidirectional Leads On Continuous Tapes |
British St.. |
2015-06-30 |
現(xiàn)行 |
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I.S. EN 60286-2:2015 |
Packaging of Components for Automatic Handling Part 2: Packaging of Components With Unidirectional Leads on Continuous Tapes |
National S.. |
2015-06-23 |
現(xiàn)行 |
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DIN EN 60297-3-108 (2015-06) |
Mechanical Structures For Electronic Equipment - Dimensions Of Mechanical Structures Of The 482,6 Mm (19 In) Series - Part 3-108: Dimensions Of R-type Subracks And Plug-in Units (iec 60297-3-108:2014) |
Verband De.. |
2015-06-01 |
現(xiàn)行 |
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IEC 60286-2 Ed. 4.0 |
Packaging of components for automatic handling Part 2: Tape packaging of components with unidirectional leads on continuous tapes |
Internatio.. |
2015-04-22 |
現(xiàn)行 |
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JIS C 62739-1:2015 |
Test Method For Erosion Of Wave Soldering Equipment Using Molten Lead-free Solder Alloy - Part 1: Erosion Test Method For Metal Materials Without Surface Processing |
Japanese S.. |
2015-04-20 |
現(xiàn)行 |
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NF EN 60297-3-108:2015 |
Mechanical Structures For Electronic Equipment - Dimensions Of Mechanical Structures Of The 482,6 Mm (19 In) Series - Part 3-108: Dimensions Of R-Type Subracks And Plug-In Units |
Associatio.. |
2015-04-01 |
現(xiàn)行 |
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SS EN 60297-3-108 Ed. 1 (2015) |
Mechanical Structures For Electronic Equipment - Dimensions Of Mechanical Structures Of The 482,6 Mm (19 In) Series - Part 108: Dimensions Of R-Type Subracks And Plug-In Units |
Standardis.. |
2015-03-11 |
現(xiàn)行 |
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DS EN 60297-3-108:2015 |
Mechanical Structures For Electronic Equipment - Dimensions Of Mechanical Structures Of The 482,6 Mm (19 In) Series - Part 3-108: Dimensions Of R-Type Subracks And Plug-In Units |
Danish Sta.. |
2015-02-26 |
現(xiàn)行 |
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I.S. EN 60297-3-108:2015 |
Mechanical Structures for Electronic Equipment - Dimensions of Mechanical Structures of the 482,6 mm (19 in) Series Part 3-108: Dimensions of R-type Subracks and Plug-in Units (iec 60297-3-108:2014) |
National S.. |
2015-02-19 |
現(xiàn)行 |
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NBN EN 60297-3-108:2015 |
Mechanical Structures For Electronic Equipment - Dimensions Of Mechanical Structures Of The 482,6 Mm (19 In) Series - Part 3-108: Dimensions Of R-Type Subracks And Plug-In Units |
Belgian St.. |
2015-02-01 |
現(xiàn)行 |
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BS EN 60297-3-108:2015 |
Mechanical Structures For Electronic Equipment - Dimensions Of Mechanical Structures Of The 482,6 Mm (19 In) Series - Part 3-108: Dimensions Of R-Type Subracks And Plug-In Units |
British St.. |
2015-01-31 |
現(xiàn)行 |
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OVE/ONORM EN 61587-5:2015 |
Mechanical Structures For Electronic Equipment - Tests For Iec 60917 And Iec 60297 - Part 5: Seismic Tests For Chassis, Subracks And Plug-In Units (Iec 61587-5:2013) |
Osterreich.. |
2015-01-01 |
現(xiàn)行 |
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NF EN 60286-3-2:2015 |
Packaging Of Components For Automatic Handling - Part 3-2: Packaging Of Surface Mount Components On Continuous Tapes - Type 6 - Blister Carrier Tapes Of 4 Mm Width |
Associatio.. |
2015-01-01 |
現(xiàn)行 |
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NEN EN IEC 60297-3-108:2015 |
Mechanical Structures For Electronic Equipment - Dimensions Of Mechanical Structures Of The 482,6 Mm (19 In) Series - Part 3-108: Dimensions Of R-Type Subracks And Plug-In Units |
Nederlands.. |
2015-01-01 |
現(xiàn)行 |
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NF EN 60286-3-1:2015 |
Packaging Of Components For Automatic Handling - Part 3-1: Packaging Of Surface Mount Components On Continuous Tapes - Type 5 - Pressed Carrier Tapes |
Associatio.. |
2015-01-01 |
現(xiàn)行 |
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OVE/ONORM EN 60191-4:2014 |
Mechanical Standardization Of Semiconductor Devices - Part 4: Coding System And Classification Into Forms Of Package Outlines For Semiconductor Device Packages (Iec 60191-4:2013) |
Osterreich.. |
2014-12-01 |
現(xiàn)行 |
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VDE 0687-587-5:2014 |
Mechanical Structures For Electronic Equipment -Tests For Iec 60917 And Iec 60297 - Part 5: Seismic Tests For Chassis, Subracks And Plug-In Units (Iec 61587-5:2013) |
Verband De.. |
2014-12-01 |
現(xiàn)行 |
