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標(biāo)準(zhǔn)編號(hào) |
標(biāo)準(zhǔn)名稱 |
發(fā)布部門 |
發(fā)布日期 |
狀態(tài) |
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IEC 61191-2 Ed. 3.0 |
Printed board assemblies Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
Internatio.. |
2017-05-23 |
現(xiàn)行 |
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I.S. EN 61587-1:2017 |
Mechanical Structures for Electronic Equipment - Tests for iec 60917 and iec 60297 Series Part 1: Environmental Requirements, Test Set-up and Safety Aspects for Cabinets, Racks, Subracks and Chassis Under Indoor Condition use and Transportation |
National S.. |
2017-05-09 |
現(xiàn)行 |
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I.S. EN 62739-3:2017 |
Test Method for Erosion of Wave Soldering Equipment Using Molten Lead-free Solder Alloy Part 3: Selection Guidance of Erosion Test Methods |
National S.. |
2017-04-18 |
現(xiàn)行 |
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DIN EN 62610-5 (2017-02) |
Mechanical Structures For Electrical And Electronic Equipment - Thermal Management For Cabinets In Accordance With Iec 60297 And Iec 60917 Series - Part 5: Cooling Performance Evaluation For Indoor Cabinets (iec 62610-5:2016) |
German Ins.. |
2017-02-01 |
現(xiàn)行 |
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IEC 62739-3 Ed. 1.0 |
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 3: Selection guidance of erosion test methods |
Internatio.. |
2017-01-06 |
現(xiàn)行 |
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IEC 61587-1 Ed. 4.0 |
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation |
Internatio.. |
2016-12-07 |
現(xiàn)行 |
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I.S. EN 62739-2:2016 |
Test Method for Erosion of Wave Soldering Equipment Using Molten Lead-free Solder Alloy Part 2: Erosion Test Method for Metal Materials With Surface Processing |
National S.. |
2016-10-25 |
現(xiàn)行 |
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DIN EN 60297-3-109 (2016-09) |
Mechanical Structures For Electrical And Electronic Equipment - Dimensions Of Mechanical Structures Of The 482,6 Mm (19 In) Series - Part 3-109: Dimensions Of Chassis For Embedded Computing Devices (iec 60297-3-109:2015) |
Verband De.. |
2016-09-01 |
現(xiàn)行 |
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IEC 62739-2 Ed. 1.0 |
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 2: Erosion test method for metal materials with surface processing |
Internatio.. |
2016-07-13 |
現(xiàn)行 |
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I.S. EN 62610-5:2016 |
Mechanical Structures for Electrical and Electronic Equipment - Thermal Management for Cabinets in Accordance With iec 60297 and iec 60917 Series Part 5: Cooling Performance Evaluation for Indoor Cabinets |
National S.. |
2016-07-12 |
現(xiàn)行 |
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IEC 62610-5 Ed. 1.0 |
Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 5: Cooling performance evaluation for indoor cabinets |
Internatio.. |
2016-04-20 |
現(xiàn)行 |
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DIN EN 61837-3 (2016-04) |
Surface Mounted Piezoelectric Devices For Frequency Control And Selection - Standard Outlines And Terminal Lead Connections - Part 3: Metal Enclosures (iec 61837-3:2015) |
German Ins.. |
2016-04-01 |
現(xiàn)行 |
|
I.S. EN 60297-3-109:2016 |
Mechanical Structures for Electrical and Electronic Equipment - Dimensions of Mechanical Structures of the 482,6 mm (19 in) Series Part 3-109: Dimensions of Chassis for Embedded Computing Devices |
National S.. |
2016-03-10 |
現(xiàn)行 |
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DIN EN 61837-4 (2016-02) |
Surface Mounted Piezoelectric Devices For Frequency Control And Selection - Standard Outlines And Terminal Lead Connections - Part 4: Hybrid Enclosure Outlines (iec 61837-4:2015) |
German Ins.. |
2016-02-01 |
現(xiàn)行 |
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IEC 60297-3-109 Ed. 1.0 |
Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-109: Dimensions of chassis for embedded computing devices |
Internatio.. |
2015-11-23 |
現(xiàn)行 |
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JIS C 6011-3:2015 |
Mechanical Structures For Electronic Equipment - Tests For Iec 60917 And Iec 60297 - Part 3: Electromagnetic Shielding Performance Tests For Cabinets And Subracks |
Japanese S.. |
2015-11-20 |
現(xiàn)行 |
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JIS C 6012-3-100:2015 |
Mechanical Structures For Electronic Equipment - Dimensions Of Mechanical Structures Of The 482.6 Mm (19 In) Series - Part 3-100: Basic Dimensions Of Front Panels, Subracks, Chassis, Racks And Cabinets |
Japanese S.. |
2015-11-20 |
現(xiàn)行 |
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JIS C 61191-2:2015 |
Printed Board Assemblies - Part 2: Sectional Specification - Requirements For Surface Mount Soldered Assemblies |
Japanese S.. |
2015-11-20 |
現(xiàn)行 |
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JIS C 6011-1:2015 |
Mechanical Structures For Electronic Equipment - Tests For Iec 60917 And Iec 60297 Series - Part 1: Environmental Requirements, Test Set-up And Safety Aspects For Cabinets, Racks, Subracks And Chassis Under Indoor Conditions |
Japanese S.. |
2015-11-20 |
現(xiàn)行 |
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JIS C 61191-1:2015 |
Printed Board Assemblies - Part 1: Generic Specification - Requirements For Soldered Electrical And Electronic Assemblies Using Surface Mount And Related Assembly Technologies |
Japanese S.. |
2015-11-20 |
現(xiàn)行 |
