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I.S. EN 62326-20:2016 Printed Boards Part 20: Printed Circuit Boards for Highbrightness Leds National S.. 2016-05-31 現(xiàn)行
IEC 61249-2-44 Ed. 1.0 Materials for printed boards and other interconnecting structures Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly Internatio.. 2016-05-12 現(xiàn)行
IEC 61249-2-43 Ed. 1.0 Materials for printed boards and other interconnecting structures Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly Internatio.. 2016-05-12 現(xiàn)行
ASTM F1896-16 Test Method for Determining the Electrical Resistivity of a Printed Conductive Material American S.. 2016-05-01 現(xiàn)行
I.S. EN 61189-3-719:2016 Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3-719: Test Methods for Interconnection Structures (printed Boards) - Monitoring of Single Plated-through Hole (pth) Resistance Change During Temperature Cycling National S.. 2016-04-26 現(xiàn)行
DIN EN 16602-70-12 (2016-04) Space product assurance - Design rules for printed circuit boards; English version FprEN 16602-70-12:2016 German Ins.. 2016-04-01 被替代
DIN EN 62878-1-1 (2016-03) Device Embedded Substrate - Part 1-1: Generic Specification - Test Methods (iec 62878-1-1:2015) German Ins.. 2016-03-01 現(xiàn)行
IEC 62899-201 Ed. 1.0 Printed electronics Part 201: Materials - Substrates Internatio.. 2016-02-25 現(xiàn)行
IEC 62899-202 Ed. 1.0 Printed electronics Part 202: Materials - Conductive ink Internatio.. 2016-02-25 現(xiàn)行
IEC 62326-20 Ed. 1.0 Printed boards Part 20: Printed circuit boards for high-brightness LEDs Internatio.. 2016-02-03 現(xiàn)行
I.S. EN 60599:2016 Mineral Oil-filled Electrical Equipment in Service - Guidance on the Interpretation of Dissolved and Free Gases Analysis National S.. 2016-02-02 現(xiàn)行
DIN EN 61189-5-503 (2016-02) Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 5-503: General Test Methods For Materials And Assemblies - Conductive Anodic Filaments (caf) Testing Of Circuit Boards (iec 91/1307/cd:2015) German Ins.. 2016-02-01 現(xiàn)行
IEC 61189-3-913 Ed. 1.0 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs Internatio.. 2016-01-05 現(xiàn)行
IEC 61189-3-719 Ed. 1.0 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling Internatio.. 2016-01-05 現(xiàn)行
KS C IEC 61182-2:2015 Printed board assembly products ? Manufacturing description data and transfer methodology ? Part 2 : Generic requirements Korean Sta.. 2015-12-30 現(xiàn)行
KS C IEC 60326-3:2015 Printed boards - Part 3:Design and use of printed boards Korean Sta.. 2015-12-30 廢止
KS C IEC 60326-5:2015 Printed boards - Part 5:Specification for single anddouble sided printed boards with plated-through holes Korean Sta.. 2015-12-30 廢止
KS C IEC 60326-2:2015 Printed boards - Part 2:Test methods Korean Sta.. 2015-12-30 廢止
KS C 6471:2015 Test methods for flexible printed wiring boards Korean Sta.. 2015-12-30 廢止
IEC/TR 63017 Ed. 1.0 Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations Internatio.. 2015-12-16 現(xiàn)行
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