HD 307.3.11 : 200S1現(xiàn)行

SPECIFICATION FOR SOLVENTLESS POLYMERISABLE RESINOUS COMPOUNDS USED FOR ELECTRICAL INSULATION - SPECIFICATIONS FOR INDIVIDUAL MATERIALS - EPOXY RESIN-BASED COATING POWDERS

出版：Harmonization Documents

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基本信息

標(biāo)準(zhǔn)編號： HD 307.3.11 : 200S1

標(biāo)準(zhǔn)類別：Standard

出版單位：Harmonization Documents

標(biāo)準(zhǔn)頁數(shù)：0

標(biāo)準(zhǔn)簡介

Contains the general and special requirements for thermosetting epoxy resin-based coating powders being applied by coating processes such as fluidized air bed, powder spraying and electrostatic coating.

等同采用的國際標(biāo)準(zhǔn)

IEC 60455-3-11 : 1.0 - Identical

CEI 15-61 : 1997 - Identical

VDE 0368 : 1972 - Identical

VDE 0355-311 : DRAFT 90 - Identical

UNE 21340-3-11 : 1993 - Similar to

NFC 26 163-11 : 1993 - Identical

BS 5664-3.11(1995) : 1995 - Identical

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HD 307.3.11 : 200S1現(xiàn)行

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