
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
出版:British Standards Institution

專家解讀視頻
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
IEC 60068-2-69 : 2017+AMD 1 : 2019 - Identical
IEC 60068-2-69 : 2017+AMD 1 : 2019 - Identical
EN 60068-2-69:2017/A1:2019 - Identical