當(dāng)前位置：
首頁 >
標(biāo)準(zhǔn)詳情頁
IEC 60191-5 Ed. 2.0現(xiàn)行
Mechanical standardization of semiconductor devices Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
出版：International Electrotechnical Committee
專家解讀視頻
基本信息
標(biāo)準(zhǔn)編號： IEC 60191-5 Ed. 2.0
發(fā)布時間：1997/4/23 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：International Electrotechnical Committee
標(biāo)準(zhǔn)頁數(shù)：71
標(biāo)準(zhǔn)簡介
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)
