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IEC 191-5 Ed. 1.0被替代

Mechanical Standardization Of Semiconductor Devices - Recommendations Applying To Tape Automated Bonding (tab) Of Integrated Circuits

出版：International Electrotechnical Committee

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基本信息
標(biāo)準(zhǔn)編號(hào)： IEC 191-5 Ed. 1.0
標(biāo)準(zhǔn)類別：Standard
出版單位：International Electrotechnical Committee
標(biāo)準(zhǔn)頁數(shù)：25
標(biāo)準(zhǔn)簡介

Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of edition of this standard. More especially, tape width and perforation dimensions have been derived from motion picture film standards. Progress in integrated circuit (IC) technology resulting in a higher number of terminals and user requirements may lead in the future to recommend additional or new dimensions.

標(biāo)準(zhǔn)備注

BS DRAFT 93/216730 DC REFERS TO A NEW REVISION

替代本標(biāo)準(zhǔn)的新標(biāo)準(zhǔn)

IEC 60191-5 Ed. 2.0

等同采用的國際標(biāo)準(zhǔn)

BS 3934-5:1992 - Identical