Prescribes general requirements for the description and testing of solder paste used in the soldering of surface-mount components or in the general soldering of electronic interconnections. It defines the characteristics of solder paste through the definition of properties and the specification of test methods and inspection criteria. The materials covered include solder powder and solder-paste flux that are blended together to produce a solder paste. The solder powders are classified as to the shape and the size distribution of the particles.

J STD 005:1995