J STD 005:1995被替代
Requirements For Soldering Pastes
出版：Institute of Printed Circuits
專家解讀視頻
Describes general requirements for characterization and test of solder pastes used to make high quality interconnections. This specification is a control document and is not intended to relate directly to a materials performance in the manufacturing process.
Supersedes QQ S 571, IPC SP 819, QPL 14256 and QPL QQ S 571. Also available in CD-ROM format. (09/2005) Included in IPC C 103 & IPC C 1000. Also available in Chinese & Japanese Languages, See J STD 005 CHINESE & J STD 005 JAPANESE respectively. (07/2009)
QQ S 571 Revision F (Collection)
MIL F 14256 Revision F (Collection)
QPL 14256 Revision 88 (Collection)
J STD 006 JAPANESE:2006 - Identical
