IEC 60749-25 Ed. 1.0現行
Semiconductor devices - Mechanical and climatic test methods Part 25: Temperature cycling
出版：International Electrotechnical Committee
專家解讀視頻
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
OVE/ONORM EN 60749-25:2004 - Identical
NEN EN IEC 60749-25:2003 - Identical
EN 60749-25:2003 - Identical
UNE EN 60749-25:2004 - Identical
PN EN 60749-25:2006 - Identical
I.S. EN 60749-25:2003 - Identical
CEI EN 60749-25 Ed. 1 (2004) - Identical
NF EN 60749-25:2003 - Identical
DIN EN 60749-25 (2004-04) - Identical
BS EN 60749-25:2003 - Identical
