
Wire Bond Shear Test
出版:JEDEC Solid State Technology Association

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基本信息
標準編號: EIA JESD 22-B116:1998
發布時間:1998/7/1 0:00:00
標準類別:Standard
出版單位:JEDEC Solid State Technology Association
標準頁數:0
標準簡介
Defines a procedure for the strength of an integrated circuit wire bond by shearing the wire from surface it is bonded to and measuring the force required. Also covers guidelines determining the appropriate minimum shear force for gold ball bonds on aluminum alloy bonding surfaces.
標準備注
Supersedes EIA JESD 22 (07/2004)
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