IEC 60749-19 Ed. 1.1現行
Semiconductor devices - Mechanical and climatic test methods Part 19: Die shear strength
出版：International Electrotechnical Committee
專家解讀視頻
基本信息
標準編號： IEC 60749-19 Ed. 1.1
發布時間：2010/11/29 0:00:00
標準類別：Standard
出版單位：International Electrotechnical Committee
標準頁數：13
標準簡介
IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
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