DIN EN 61191-3 (1999-06)現行
Printed Board Assemblies - Part 3: Sectional Specification - Requirements For Through-hole Mount Soldered Assemblies
出版：German Institute for Standardisation (Deutsches Institut für Normung)
專家解讀視頻
Gives requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that also include other relating technologies (i.e. chip mounting, surface mount, terminal mounting)
DRAFT 2016 issued in January 2016. (01/2016)
I.S. EN 61191-3:1999 - Identical
NBN EN 61191-3:1999 - Identical
SS EN 61191-3 Ed. 1 (1998) - Identical
IEC 61191-3 Ed. 1.0 - Identical
NF EN 61191-3:2000 - Identical
BS EN 61191-3:1999 - Identical
SN EN 61191-3:1998 - Identical
SN EN 61191-3:2017 - Identical
BS EN 61191-3:2017 - Identical
EN 61191-3:2017 - Identical
