I.S. EN 61191-3:1999被替代
Printed Board Assemblies Part 3: Sectional Specification - Requirements For Through-hole Mount Soldered Assemblies
出版：National Standards Authority of Ireland
專家解讀視頻
Covers requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
SS EN 61191-3 Ed. 1 (1998) - Identical
NBN EN 61191-3:1999 - Identical
IEC 61191-3 Ed. 1.0 - Identical
NF EN 61191-3:2000 - Identical
DIN EN 61191-3 (1999-06) - Identical
BS EN 61191-3:1999 - Identical
SN EN 61191-3:1998 - Identical
EN 61191-3:2017 - Identical
