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NEN EN IEC 60749-21:2005被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 21: Solderability
出版：Nederlands Normalisatie Instituut
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基本信息
標(biāo)準(zhǔn)編號(hào)： NEN EN IEC 60749-21:2005
發(fā)布時(shí)間：2005/3/1 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：Nederlands Normalisatie Instituut
標(biāo)準(zhǔn)頁(yè)數(shù)：20
標(biāo)準(zhǔn)簡(jiǎn)介
Defines a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
替代本標(biāo)準(zhǔn)的新標(biāo)準(zhǔn)
