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8 Mm Through 200 Mm Embossed Carrier Taping And 8 Mm And 12 Mm Punched Carrier Taping Of Surface Mount Components For Automatic Handling
出版:JEDEC Solid State Technology Association

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基本信息
標(biāo)準(zhǔn)編號(hào): EIA 481:2003
發(fā)布時(shí)間:2003/10/1 0:00:00
標(biāo)準(zhǔn)類別:Standard
出版單位:JEDEC Solid State Technology Association
標(biāo)準(zhǔn)頁數(shù):52
標(biāo)準(zhǔn)簡介
Covers requirements for taping surface mount components.
標(biāo)準(zhǔn)備注
Supersedes EIA 783. (05/2004) Supersedes EIA 481-1 and EIA 481-2 (05/2006)
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