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標準編號 標準名稱 發(fā)布部門 發(fā)布日期 狀態(tài)
CEI EN 50625-1 Ed. 1 (2014) Collection, Logistics & Treatment Requirements For Weee - Part 1: General Treatment Requirements Comitato E.. 2014-08-01 被替代
NF EN 50625-1:2014 Collection, Logistics & Treatment Requirements For Weee - Part 1: General Treatment Requirements Associatio.. 2014-07-01 現(xiàn)行
14/30294300 DC Bs En 50625-2-1 - Collection, Logistics & Treatment Requirements For Weee - Part 2-1: Treatment Requirements For Lamps British St.. 2014-06-02 被替代
OVE/ONORM EN 62047-19:2014 Semiconductor Devices - Micro-Electromechanical Devices - Part 19: Electronic Compasses (Iec 62047-19:2013) Osterreich.. 2014-06-01 現(xiàn)行
NEN EN 50625-2-1:2014 Collection, Logistics And Treatment Requirements For Weee - Part 2-1: Treatment Requirements For Lamps Nederlands.. 2014-06-01 被替代
PREN 50625-2-1:2014 Collection, Logistics & Treatment Requirements For Weee - Part 2-1: Treatment Requirements For Lamps European C.. 2014-05-01 被替代
KS C IEC 60512-1-4:2014 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1:General - Section 4:Test 1d:Contact protection effectiveness(scoop - proof) Korean Sta.. 2014-04-02 廢止
DIN EN 62047-11 (2014-04) Semiconductor Devices - Micro-electromechanical Devices - Part 11: Test Method For Coefficients Of Linear Thermal Expansion Of Free-standing Materials For Micro-electromechanical Systems (iec 62047-11:2013) German Ins.. 2014-04-01 現(xiàn)行
DIN EN 62047-19 (2014-04) Semiconductor Devices - Micro-electromechanical Devices - Part 19: Electronic Compasses (iec 62047-19:2013) German Ins.. 2014-04-01 現(xiàn)行
DIN EN 62047-18 (2014-04) Semiconductor Devices - Micro-electromechanical Devices - Part 18: Bend Testing Methods Of Thin Film Materials (iec 62047-18:2013) German Ins.. 2014-04-01 現(xiàn)行
BS EN 50625-1:2014 Collection, Logistics & Treatment Requirements For Weee - Part 1: General Treatment Requirements British St.. 2014-03-31 現(xiàn)行
I.S. EN 50625-1:2014 Collection, Logistics & Treatment Requirements for Weee Part 1: General Treatment Requirements National S.. 2014-03-18 現(xiàn)行
NEN EN 50625-1:2014 Collection, Logistics & Treatment Requirements For Weee - Part 1: General Treatment Requirements Nederlands.. 2014-03-01 現(xiàn)行
KS C IEC 60512-13-1:2014 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 13:Mechanical operating tests - Section 1:Test 13a:Engaging and separating forces Korean Sta.. 2014-01-31 廢止
KS C IEC 60512-12-6:2014 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12:Soldering tests - Section 6:Test 12f:Sealing against flux and cleaning solvents in machine soldering Korean Sta.. 2014-01-31 廢止
KS C IEC 60512-2:2014 Electromechanical components for electronic eqipment - Basic testing procedures and measuring methods - Part 2:General examination, electrical continuity and contact resistance tests, insulation tests and voltage stress tests Korean Sta.. 2014-01-31 廢止
KS C IEC 60512-23-3:2014 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23 - 3:Test 23c:Shielding effectiveness of connectors and accessories Korean Sta.. 2014-01-31 廢止
KS C IEC 60512-19-3:2014 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 19:Chemical resistance tests - Section 3:Test 19c - Fluid resistance Korean Sta.. 2014-01-31 廢止
KS C IEC 60512-11-7:2014 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11:Climatic tests - Section 7:Test 11g:Flowing mixed gas corrosion test Korean Sta.. 2014-01-31 廢止
KS C IEC 60512-20-2:2014 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20 - 2:Test 20b - Flammability tests - Fireproofness Korean Sta.. 2014-01-31 廢止
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