IEC 60068-2-58 Ed. 4.1現行
Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
出版：International Electrotechnical Committee
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基本信息
標準編號： IEC 60068-2-58 Ed. 4.1
發布時間：2017/7/28 0:00:00
標準類別：Standard
出版單位：International Electrotechnical Committee
標準頁數：73
標準簡介
Gives procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
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