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Area Array Package Assembly and Manufacturing Practices for Flight Hardware
出版:National Aeronautics and Space Administration

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基本信息
標(biāo)準(zhǔn)編號: NASA GSFC-STD-6001:2021
標(biāo)準(zhǔn)類別:Standard
出版單位:National Aeronautics and Space Administration
標(biāo)準(zhǔn)頁數(shù):0
標(biāo)準(zhǔn)簡介
The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free area array solder joint interconnects to printed circuit boards intended for use in Flight, Flight Spare and Custom Mission Critical Support Hardware applications.