IEC 60191-4 Ed. 3.1現行
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
出版：International Electrotechnical Committee
專家解讀視頻
基本信息
標準編號： IEC 60191-4 Ed. 3.1
發布時間：2018/3/27 0:00:00
標準類別：Standard
出版單位：International Electrotechnical Committee
標準頁數：158
標準簡介
IEC 60191-4:2013 defines a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
本標準替代的舊標準
