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IEC 60068-2-69 Ed. 3.0現(xiàn)行
Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
出版：International Electrotechnical Committee
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基本信息
標(biāo)準(zhǔn)編號： IEC 60068-2-69 Ed. 3.0
發(fā)布時(shí)間：2017/3/7 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：International Electrotechnical Committee
標(biāo)準(zhǔn)頁數(shù)：110
標(biāo)準(zhǔn)簡介
Describes test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
