JIS C 60068-2-58:2016現行
Environmental Testing - Part 2-58: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版：Japanese Standards Association
專家解讀視頻
基本信息
標準編號： JIS C 60068-2-58:2016
發布時間：2016/12/20 0:00:00
標準類別：Standard
出版單位：Japanese Standards Association
標準頁數：26
標準簡介
Outlines test Td, applicable to surface mounting devices (SMD). Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD).
