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EIA 364-61:2014現(xiàn)行
Resistance To Soldering Heat From Rework Test Procedure For Electrical Connectors And Sockets Mounted On Printed Circuit Boards
出版：Joint Electronics Device Engineering Council (JEDEC)
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基本信息
標(biāo)準(zhǔn)編號： EIA 364-61:2014
發(fā)布時間：2014/5/1 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：Joint Electronics Device Engineering Council (JEDEC)
標(biāo)準(zhǔn)頁數(shù)：18
標(biāo)準(zhǔn)簡介
Specifies a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot/fountain/wave solder, or hot gas/vapor techniques.
本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)
