IEC 62880-1 Ed. 1.0現行
Semiconductor devices - Stress migration test standard Part 1: Copper stress migration test standard
出版：International Electrotechnical Committee
專家解讀視頻
基本信息
標準編號： IEC 62880-1 Ed. 1.0
發布時間：2017/8/23 0:00:00
標準類別：Standard
出版單位：International Electrotechnical Committee
標準頁數：28
標準簡介
Specifies a constant temperature (isothermal) aging method for testing copper (Cu) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding (SIV).
