This standard applies to hot and cold curing foam compounds (hereinafter referred to as foam compounds) used in space systems products and intended: - for electrical insulation and hardening of open-frame electrical connectors by casting; - sealing and vibration protection of electrical products; - alignment of defective surfaces with applied thermal insulation; - gluing (by pouring) embedded elements into honeycomb panels in order to strengthen them; - gluing parts made of metals and non-metals with large alternating gaps; - filling by filling closed cavities of lightweight metal structures in order to increase their rigidity characteristics.